CMDSH-4E TR PBFREE

CMDSH-4E ENHANCED SPECIFICATION SURFACE MOUNT SILICON SCHOTTKY DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMDSH-4E is an enhanced version of the CMDSH-3 silicon Schottky diode in an SOD-323 surface mount package. ENHANCED SPECIFICATIONS: ♦ IO from 100mA MAX to 200mA MAX ♦ BVR from 30V MIN to 40V MIN ♦ VF from 1.0V MAX to 0.8V MAX SOD-323 CASE MAXIMUM RATINGS: (TA=25°C) MARKING CODE: S1E SYMBOL ♦ Peak Repetitive Reverse Voltage ♦ Average Forward Current VRRM IO Peak Repetitive Forward Current Peak Forward Surge Current, tp=10ms Power Dissipation Operating and Storage Junction Temperature Thermal Resistance UNITS 40 V 200 mA IFRM IFSM 350 mA 750 mA PD TJ, Tstg 250 mW -65 to +150 °C ΘJA 500 °C/W ELECTRICAL SYMBOL IR CHARACTERISTICS: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP VR=25V 90 IR VR=25V, TA=100°C IR=100μA ♦ BVR VF 25 40 MAX 500 UNITS nA 100 μA 50 V IF=2.0mA 0.29 0.33 V IF=15mA 0.37 0.42 V IF=100mA IF=200mA 0.51 0.80 V 0.65 1.0 V CJ VR=1.0V, f=1.0MHz 7.0 trr IF=IR=10mA, Irr=1.0mA, RL=100Ω ♦ VF ♦ VF ♦♦ VF pF 5.0 ns ♦ Enhanced specification. ♦♦ Additional Enhanced specification. R3 (11-February 2016) CMDSH-4E ENHANCED SPECIFICATION SURFACE MOUNT SILICON SCHOTTKY DIODE SOD-323 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Cathode 2) Anode MARKING CODE: S1E R3 (11-February 2016) w w w. c e n t r a l s e m i . c o m CMDSH-4E ENHANCED SPECIFICATION SURFACE MOUNT SILICON SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R3 (11-February 2016) w w w. c e n t r a l s e m i . c o m CMDSH-4E ENHANCED SPECIFICATION SURFACE MOUNT SILICON SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R3 (11-February 2016) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)